Tungsten offers nano-interconnects a path of least resistance

One promising possibility involves reducing the resistivity

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size effect by altering the crystalline orientation of interconnect materials. A pair of researchers from Rensselaer Polytechnic Institute conducted electron transport measurements in epitaxial single-crystal layers of tungsten (W) as one such potential interconnect solution. They performed first-principles simulations, finding a definite orientation-dependent effect. The anisotropic resistivity effect they found was most marked between layers with two particular orientations of the lattice structure, namely W(001) and W(110). The work is published this week in the Journal of Applied Physics.

Author Pengyuan Zheng noted that both the 2013 and 2015 International Technology Roadmap for Semiconductors (ITRS) called for new materials to replace copper as interconnect material to limit resistance increase at reduced scale and minimize both power consumption and signal delay.

In their study, Zheng and co-author Daniel Gall chose tungsten because of its asymmetric Fermi surface—its electron energy structure. This made it a good candidate to demonstrate the anisotropic resistivity effect at the small scales of interest. "The bulk material is completely isotropic, so the resistivity is the same in all directions," Gall said. "But if we have thin films, then the resistivity varies considerably."

Read more at: https://phys.org/news/2017-10-tungsten-nano-interconnects-path-resistance.html#jCp